Attend the networking-focused event exclusively for 3D and wafer-level packaging!

Register	Participation is limited by the intimate and exclusive nature of the event—reserve your seat today! Registration covers all meetings, use of the Connect in 3D DealCenter online scheduling tool, meals, breaks, and receptions. Early registration discounts close June 30, 2012. Register now!
Sponsor	Leap to the forefront of the industry with a customized sponsorship! We’ve crafted valuable, high-visibility sponsorship packages for every budget. Learn more.
VIEW	Discover the power of Collaborative Summits^SM. Listen to what your contemporaries say about our high-technology events. Watch the video (Youtube link). This three-minute video includes testimonials by executives from Sensor Platforms, STMictroelectronics, SoftMEMS and others.
PROGRAM	Learn about the powerful functions that will fill your days at Connect in 3D 2012. This unique program has been engineered to deliver more networking—more opportunities—to develop the contacts and relationships you need to thrive in business. View the event program.

The Connect in 3D Collaboration Summit^SM removes the guesswork by allowing you to schedule important meetings weeks before the event, and then gives you the flexibility of adding or modifying your meeting schedule once you’re there.

1. Join the industry’s elite—a veritable Who’s Who in 3D & wafer-level packaging
2. More than 600 one-on-one meetings
3. Powerful DealCenter online meeting scheduling tool
4. Schedule meetings before and during the event
5. Two days of shared meals, receptions, functions, meetings and more
6. Delegates control their meeting schedules
7. Discover collaboration partners
8. Most efficient use of your valuable time
9. Condense months of relationship-building work into two days
10. Enjoy an intimate setting rich with networking opportunities
11. Meet with hard-to-reach, highly qualified participants
12. Be a part of the dialog on the future of 3D & wafer-level packaging: learn, talk, collaborate